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A23W9308
Preliminary
Document Title 524,288 X 8 BIT CMOS MASK ROM Revision History
Rev. No.
0.0
524,288 X 8 BIT CMOS MASK ROM
History
Initial issue
Issue Date
November 2, 1999
Remark
Preliminary
PRELIMINARY
(November, 1999, Version 0.0)
AMIC Technology, Inc.
A23W9308
Preliminary
Features
n n n n n 524,288 x 8 bit organization Wide power supply range : +2.7V to +5.5V Access time: 120 ns (max.)/5V 150 ns (max.)/3V Current: Operating: 50mA (max.)/5V 15mA (max.)/3V Standby: 50A (max.)/5V 25A (max.)/3V n Mask Programmed for Chip Enable (power-down) CE/ CE , Output Enable OE/ OE /NC n Three-state outputs for wired-OR expansion n Full static operation n All inputs and outputs are directly TTL-compatible n Available in 32-pin DIP, 32-pin SOP, 32-pin PLCC packages or in DICE FORM.
524,288 X 8 BIT CMOS MASK ROM
General Description
The A23W9308 high-performance Read Only Memory is configured as 524,288 x 8 bits. It is designed to be compatible with all microprocessors and similar applications where high-performance, large-bit storage, and simple interfacing are important design considerations. This device is designed for use with operating voltage from 3V to 5V. The A23W9308 offers an automatic POWER-DOWN controlled by the Chip Enable CE/ CE input. When CE/ CE goes low/high, the device will automatically POWER-DOWN and remain in a low power STANDBY mode as long as CE/ CE remains low/high. A23W9308 also offers OE/ OE /NC (Active High or Low or No Connection), which eliminates bus contention in multiple bus microprocessor systems.
Pin Configurations
n P-DIP / SOP n PLCC
VCC A12 A15 A16 A18 31 A17 30 NC 1
NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND
1 2 3 4 5
32 31 30 29 28
VCC A18
A14 A13 A8 A9 A11 OE/OE/NC A10 CE/CE O7 O6 O5
A7 A6 A5 A4 A3 A2 A1 A0 O0
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
32
4
3
2
A17
29 28 27 26
A14 A13 A8 A9 A11 OE/OE/NC A10 CE/CE O7
A23W9308
6 7 8 9 10 11 12 13 14 15 16
27 26 25 24 23 22 21 20 19 18 17
A23W9308
25 24 23 22 21
GND
O2
O3
O3
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
O5
O1
O4
O6
O4
A23W9308
Block Diagram
ROW DECODER DRIVER
MEMORY CELL ARRAY 524,288 X 8
A0 - A18 ADDRESS INPUTS
COLUMN DECODER DRIVER COLUMN SELECTOR CIRCUITRY
O0 O1 CE/CE POWER-DOWN OR OUTPUT ENABLE CIRCUITRY O2 O3 O4 O5 O6 O7
OE/OE/NC
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AMIC Technology, Inc.
A23W9308
Pin Descriptions
Pin No. 32L DIP/SOP 2 - 12, 23, 25 - 31 22 24 13 - 15, 17 - 21 32 16 1 32L PLCC 2 - 12, 23, 25 - 31 22 24 13 - 15, 17 - 21 32 16 1 A0 - A18 CE/ CE OE/ OE /NC O0 - O7 VCC GND NC Address Inputs Chip Enable Input (Note 1) Output Enable (Note 1) Data Outputs Power Supply Ground No Connection (Note 2) Symbol Description
Notes: 1. This pin is user-definable as active high or active low. 2. NC indicates "No Connection."
Recommended DC Operating Conditions
(TA = 0C to + 70C) Symbol VCC GND VIH VIL Supply Voltage Ground Input High Voltage Input Low Voltage Parameter Min. 2.7 0 0.7* VCC - 0.5 Max. 5.5 0 VCC+0.3 0.8 Unit V V V V
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
A23W9308
Absolute Maximum Ratings*
Ambient Operating Temperature . . . . . . . -10C to + 80C Storage Temperature . . . . . . . . . . . . . . -65C to + 150C Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW
*Comments
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
DC Electrical Characteristics (TA = 0C to + 70C, GND = 0V)
Symbol Parameter 5.0V 10% Min. VOH Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Supply Current Standby Supply Current (TTL) Standby Supply Current (CMOS) 2.2 2.4 Max. 3.0V 10% Min. 2.15 Max. V IOH = -1mA (5V) IOH = -0.4mA (3V) IOL = 3.2mA (5V) IOL = 1.6mA (3V) Unit Conditions Note
VOL
0.4
0.4
V
VlH
VCC + 0.3
0.7 * VCC
VCC+0.5
V
VlL
-0.5
0.8
-0.5
0.6
V VCC = max. VIN = VCC to GND VCC = max. VOUT = VCC to GND tCYC = min. 1
lLI lLO
+10
+5
A A
+10
+5
ICC
50
15
mA
2
ISB
1.5
0.5
mA
CE = VIH, CE = VIL CE = VCC - 0.2V, CE = 0.2V
ISB1
50
25
A
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
A23W9308
Capacitance
Symbol CI CO Parameter Input Capacitance Output Capacitance Min. Max. 10 10 Unit pF pF Test Conditions TA = 25C f = 1.0MHz Note 3
AC Characteristics
Symbol
(TA = 0C to +70C, GND = 0V) Parameter 5.0V 10% Min. Max. 3.0V 10% Min. 150 120 120 70 10 10 30 10 10 70 150 150 90 Max. ns ns ns ns ns ns ns 4, 6 5, 6 Unit Note
tCYC tAA tACE tAOE tOH tLZ tHZ
Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Output Hold after Address Change Output Low Z Delay Output High Z Delay*
120
* tHZ is specified from either OE / OE or CE / CE going disabled, whichever occurs first. Notes: 1. OE/CE = VIL, OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, but OE/CE = VIH, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested.
PRELIMINARY
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AMIC Technology, Inc.
A23W9308
Timing Waveforms
Propagation Delay from Address (CE/ CE = Active, OE/ OE = Active)
tCYC ADDRESS INPUTS VALID
tAA
tOH
DATA OUT
VALID
Propagation Delay from Chip Enable or Output Enable (Address Valid)
CHIP ENABLE
VALID
tACE
OUTPUT ENABLE
VALID
tAOE tHZ tLZ VALID tLZ
DATA OUT
AC Test Conditions
Applied Voltage Input Pulse Levels Input Rise and Fall Time Timing Measurement Reference Level Output Load 5.0V 10% 0.4V to 2.4V 10 ns VIH = 2.2V VOH = 2.0V VIL = 0.8V VOL = 08V 3.0V 10% 0.4V to 2.4V 10 ns VIN = 1.5V VOUT = 1.5V
1 TTL gate and CL = 100pF
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
A23W9308
Function Table
CE/ CE A I A OE/ OE /NC A X I O0 - O7 Data Out Hi - Z Hi - Z Mode Read Power-down Output Disable
1. CE/ CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection. 2. "A" means "Active," "I" means "Inactive," and "X" means "Either."
Ordering Information
Access Time (ns) Part No. 5.0V A23W9308 A23W9308M A23W9308L A23W9308H 120 120 120 120 3.0V 150 150 150 150 32L DIP 32L SOP 32L PLCC DICE FORM Package
PRELIMINARY
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AMIC Technology, Inc.
A23W9308
Pad Configurations
VCC
VCC
A12
A15
A16
A18
A17
A14
A13
8
7
6
5
4
3
2
1
33
32
31
30
29
28
27
26
Y
X (0,0)
9
10
11 12
13 14 15 16
17 18 19 20
21 22 23
24
25
GND
GND
O0
O1
O2
O3
O4
O5
O6
O7
CE/CE
A10
A3
A2
A1
A0
Pad Location
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Pad Name VCC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND GND Coordinate (um) X Y -73.6 1406.3 -259.9 1419.2 -409.9 1419.2 -532.9 1419.2 -682.9 1419.2 -805.9 1419.2 -955.9 1419.2 -1078.9 1419.2 -1079.3 -1419.7 -956.3 -1419.2 -806.3 -1419.2 -683.3 -1419.2 -529.3 -1419.7 -406.3 -1419.7 -254.8 -1419.7 -131.8 -1419.7 -8.8 -1417.7 Pad No. 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Pad Name O3 O4 O5 O6 O7 CE/ CE A10 OE/ OE /NC A11 A9 A8 A13 A14 A17 A18 VCC Coordinate (um) X Y 138.7 -1419.7 261.7 -1419.7 413.2 -1419.7 536.2 -1419.7 687.7 -1419.7 810.7 -1419.2 960.7 -1419.2 1083.7 -1419.2 1083.3 1419.2 960.3 1419.2 810.3 1419.2 687.3 1419.2 537.3 1419.2 414.3 1419.2 264.3 1419.2 97.1 1417.7
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
OE/OE/NC
A11
A4
A5
A6
A7
A8
A9
A23W9308
Package Information
P-DIP 32L Outline Dimensions unit: inches/mm
D 32 17
E
1
16 E1 C
A2
A
A1
Base Plane
Seating Plane B B1 e EA
L
Symbol A A1 A2 B B1 C D E E1 EA e L
Dimensions in inches Min 0.015 0.149 1.645 0.537 0.590 0.630 0.120 0 Nom 0.154 0.018 0.050 0.010 1.650 0.542 0.600 0.650 0.100 0.130 Max 0.210 0.159 1.655 0.547 0.610 0.670 0.140 15
Dimensions in mm Min 0.381 3.785 41.783 13.64 14.986 16.002 3.048 0 Nom 3.912 0.457 1.270 0.254 41.91 13.767 15.240 16.510 2.540 3.302 Max 5.334 4.039 42.037 13.894 15.494 17.018 3.556 15
Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins.
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
A23W9308
Package Information
SOP (W.B.) 32L Outline Dimensions
32 17
unit: inches/mm
HE
E
L 1 b 16 Detail F
D c A2 A S Seating Plane y D
e
A1
LE See Detail F
Dimensions in inches
Dimensions in mm Min 0.10 2.57 0.36 0.15 11.18 1.12 13.87 0.58 1.19 0 Nom 2.69 0.41 0.20 20.45 11.30 1.27 14.12 0.79 1.40 Max 3.00 2.82 0.51 0.31 20.75 11.43 1.42 14.38 0.99 1.60 0.91 0.10 10
Symbol
A A1 A2 b c D E e HE L LE S y
Min 0.004 0.101 0.014 0.006 0.440 0.044 0.546 0.023 0.047 0
Nom 0.106 0.016 0.008 0.805 0.445 0.050 0.556 0.031 0.055 -
Max 0.118 0.111 0.020 0.012 0.817 0.450 0.056 0.566 0.039 0.063 0.036 0.004 10
Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.
PRELIMINARY
(November, 1999, Version 0.0)
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AMIC Technology, Inc.
A23W9308
Package Information
PLCC 32L Outline Dimension unit: inches/mm
HD D 13 5
14
4
1 32
20
30
21
29
A2
A
HE
E
b1 GD y D
A1
e
b
GE
Dimensions in inches
Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0 Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 Max 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10
Symbol
A A1 A2 b1 b C D E e GD GE HD HE L y
Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0
Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 -
Max 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10
Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only.
PRELIMINARY
(November, 1999, Version 0.0)
11
AMIC Technology, Inc.
L
c
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